00:42:21 Kate Hendle: Welcome to the Rack & Power Tech Talk! Feel free to put any questions you have here in the chat box. 00:44:15 Archna Haylock: Appreciate everyone muting themselves if they are not speaking! This call is being recorded! 00:49:47 Steve Moore: Yes 00:49:57 Alex Lin: technically, ORv2 supports 48V as well, in v2.2 at least 00:52:16 Andrew Junkins: Is the 1600kg a dynamic load rating (max weight for in-rack shipping)? 00:52:19 Steve Mills: @Alex - you are correct. ORV2 supports 48V also. The META contribution will only support 48V. 00:53:43 Steve Mills: @andy - yes, the META version will support 1600kg of IT Gear during shipment in the rack 00:54:01 Adam Tropp: Is there any requirement on how the frame is manufactured or is it purely if it meets the specification? For example welded vs bolt together frames, type of welds needed... I read the spec that as long as the cabinet meets the requirements the construction is not dictated. 00:55:44 Steve Mills: @Adam - the generic BASE spec will NOT define construction methods. The META product specification will. 00:56:08 Steve Helvie: Just to clarify for those enterprises who prefer traditional 19” servers….would they be able to use ORv3 ? 00:57:31 Hisa T: Would we flip the front / rear inner rail to convert from OCP 21” to 19”? 01:02:00 Tino Lin: May I know the material of Side Panel? Thanks. 01:02:16 Mark Chang (FOXCONN ME PM): What’s the material for that side panel? Plastic or sheetmetal? 01:04:35 Steve Mills: @Helvie Traditional gear requires AC power and is thinner than OCP gear. So, you need an adapter for both power and mechanical just like ORV2. We are adding features into the rack at RU increments to allow users of RU gear to get the density those users are expecting in a rack. However an adapter is still needed. There is no plan to contribute an adapter yet, but it would be valuable. 01:05:42 Steve Mills: @Hisa - the META design doesn't have the ability to flip, but there is nothing in the base spec that will prevent someone from creating one for contribution. 01:06:13 Hisa T: @Steve Mills : Thanks! 01:08:21 Jason Yang: @Steve Helvie LITEON has 19" ORv3 PowerShelf solution, welcome to contact "jason.yang@liteon.com" for further discussion 01:08:59 Hisa T: Question about the liquid manifold, would you give me an example of what servers (any OEM/ODM) you are targeting to be racked? Also, is there any particular requirement for the data center facility? 01:11:45 Hisa T: 25th of May at Cooling environment project! Okay! 01:14:09 David Eales: Revision 0.1 for frame has GR63 zone 2/zone4 noted. Has this been tested? 01:14:16 Archna Haylock: Cooling Environments Tech Talks are on 2 days - May 24-25. You can get register here: https://www.eventbrite.com/e/ocp-tech-talk-cooling-environments-session-1-registration-277742444127 01:16:50 Sam Ye: Is Fan loss included? 01:17:14 Steve Mills: @David Eales - The META version has not done this testing yet. Only transportation testing so far. As Steve Moore noted - this is next up in the design 01:17:24 Hamid Keyhani: Per spec, Fan loss should be included. 01:17:40 Darryl Daniel: @David Eales - GR63 Z2/Z4 has not been physically tested yet; seismic kits are in development and undergoing FEA to look at deflections/stresses within rack. Traditional shock/vibe has been completed on multiple rounds of prototypes 01:25:23 Joe Skorjanec: 2OU shelf appears to have a different input connector 01:25:54 Joe Skorjanec: what kw does it support 01:26:39 Joe Skorjanec: thanks 01:26:55 Greg Sellman - AMD: is there an expected maximum kW per rack? 01:27:43 Andrew Junkins: AC feed to the 2U shelf would be 2* 63A 3-phase to reach 60kW? 01:54:12 Steve Helvie: Hi..is this product currently available from delta? 02:04:47 Alex Lin: The GPIO for liquid cooling means for connecting to the in-rack CDU? 02:05:25 Han Wang: Is there a SW spec for this RMD to address the management capabilities? SB and NB. Any management profiles defined? 02:06:42 Sudhindra Barve: Not, yet .. 02:08:03 Han Wang: Will 24 port sufficient for a rack? 02:10:28 Kevin Van Pelt: What is driving the high BW uplink for management data? 02:11:14 Sudhindra Barve: Uplink port is mostly driven by ToR - ToRs migrating to higher BWs 02:36:10 Kevin Van Pelt: It was just stated that the pcb mount doesn't meet temp rise with 12AWG wire externally and that it wasn't hot pluggable. was the last slide still relevant? 02:36:11 Nate Potteiger: On the specification for the input connector it calls for a cable hood that would accommodate 7 8 AWG wires on the whip side. Is this a hard requirement or just describing the cable hood since the 8 AWG wires will not fit into the rack space 02:36:24 Greg Sellman - AMD: is there a recommended land pattern and suggestion for the amount of copper on the PCB to ensure the connector Trise stays below 30C? 02:39:50 Will Stewart: Hi Kevin - the T rise issue was specific for 32A operating amperage. If the operating amperage is <32A, then the PCB-mounted bulkhead may be acceptable. I would recommend testing any preferred configuration is used to ensure compatibility 02:41:01 Rahul Vira: is it just me or is Natesh's voice very distorted? 02:41:12 Jay Sandidge: From Positronic's perspective, both male connectors meet the performance requirements outlined in the spec. 02:41:25 Kali Burdette: It does seem jumbled 02:41:27 Greg Sellman - AMD: audio is garbled 02:42:02 Archna Haylock: its his connection….sorry 02:42:33 Jay Sandidge: There are some customers that may use #8 wires so the hood needed to accommodate that. 02:43:25 Will Stewart: Hi Nate - the connector contacts are sized up to 8AWG. They can be used, the operator just needs to consider cable routing / where they place the power shelf 02:44:40 Nate Potteiger: Thank you for the clarification 02:53:37 Natesh: All, sorry about the audio. If you have question please shoot directly 03:01:25 Natesh: @greg, Yes, recommended PCB footprint is part of the spec. But PTH and details are not part of the spec. 03:07:21 Kevin Van Pelt: Why does the mating connector have contacts on outside of connector (appeared that way)? Seeing the bus bar, they contact the insulator 03:08:57 Mark: Any tolerances for Detail B? 03:09:23 Steve Pressel: Ground contacts on connector (outside of connector) make contact to conductive surface for chassis ground 03:09:36 Kevin Van Pelt: OK, just answered my question. 03:15:19 Dmitriy Shapiro: @Mark, good callout. We will add tolerances to those.